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Detailed information
Impedance Control PCB Manufacturing
NOD Electronics has many years of experience producing PCB and low-quantity production runs with short lead times for many different types of applications.
In order for a PCB manufacturer to properly execute an order, it needs a set of exact sizes and coordinates, trace widths, hole patterns and, of course, tolerances. PCB Impedance is the sum of reactance, or the AC component, and resistance, or the DC component of an electric circuit. PCB manufacturing maker are expected to conform to the PCB trace impedance values and tolerances specified by the designer in order for the board to behave as desired.
Our Capabilities of Impedance Control PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1 Costs and Quotation of Impedance Control PCB Manufacturing
The total costs of impedance control PCB manufacturing and PCB assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (gerbers) and BOM to get instant quotation within 24 hours.
For more critical applications you will need to specify “controlled impedance” and supply the actual impedance requirements for the conductors and we will fine tune the dielectrics and conductors to meet these requirements. The impedance requirements will have to be specified based on the layer and the conductor widths.
