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Detailed information
Lead Free Circuit Board
The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive.
Our Capabilities of Circuit Board Manufacturing
Through Hole HDI Flexible PCB Max. Layers 20 Min. Line Width/Space 0.05/0.05mm Max. Plate Size 2000*240mm Max. Plate Thickness 8.0mm Key Line/Tolerance 0.065/15% Max. Layers 10 Min. Plate Thickness 0.4mm Min. Blind Hole Diameter 0.10mm Min. Line Width/Space (1/4OZ) 0.04mm Max. thickness/Diameter Ratio 14:01 Blind Hole Loading Pad Size 0.23mm Min. Line Width/Space (1/3OZ) 0.05mm Max. Copper Thickness 4OZ PTH & Blind Hole Size 0.20mm Min. Line Width/Space (1/2OZ) 0.055mm Max. Plate Size 2000x610mm PTH PAD Size 0.35mm Min. Through Hole 0.15mm Min. Thickness of 4 Layers PCB 0.33mm Blind Hole thickness/Diameter Ratio 1:01 Min. Hole Pad 0.25mm Min. Mechanical Hole/Pad 0.15/0.35mm HDI Orders 3+N+3 Min. Laser Hole 0.10mm Drilling Precision +/-0.025mm Min. Thickness of 8 Layers PCB 0.8mm Min. Laser Hole Pad 0.25mm PTH Hole Tolerance +/-0.03mm Min. Pad Side Window 0.038mm Cover Film Alignment Tolerance 0.15mm Min. Line Width/Space 0.065/0.065mm Min. Ink Bridge 0.065mm Shape Tolerance 0.05mm Min. CSP/BGA Space / Min. Slot Width 0.60mm Impedance Tolerance ±5% Pitch Tolerance ±0.05mm Rigid Flex (YES/NO) Yes Air Gap (Yes/No) Yes Surface Finish: ENIG/OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink NOD electronics is a leader in Printed Circuit Board solutions and is committed to taking an active role in working closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from their products. As an ISO 9001:2000 registered company, NOD electronics is fully supportive of electronics industry efforts throughout the world to phase out the use of lead and other undesirable elements.
