Lead Free PCB Fabrication and Assembly
  • Detailed information

    NOD Electronics is a leader in Printed Circuit Board solutions and is committed to taking an active role in working closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from their products. As an ISO 9001:2000 registered company, NOD Electronics is fully supportive of electronics industry efforts throughout the world to phase out the use of lead and other undesirable elements.


    The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive.

    Our Capabilities of PCB Fabrication

    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:1
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

    NOD Electronics is a leader in providing an extensive array of lead free PCB fabrication. NOD electronics 's lead free products are fully RoHS compliant.


Lead Free PCB Fabrication and Assembly

The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive.


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