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Detailed information
Lead Free PCB Manufacturing
The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive. Electronic Interconnect manufactures LEAD FREE circuit boards using customer specified RoHS compliant materials.
Our Capabilities of PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1 NOD Electronics is a leader in PCB manufacturing and is committed to taking an active role in working closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from their products. As an ISO 9001:2000 registered company, NOD Electronics is fully supportive of electronics industry efforts throughout the world to phase out the use of lead and other undesirable elements.
Lead Free PCB Manufacturing
The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive. Electronic Interconnect manufactures LEAD FREE circuit boards using customer specified RoHS compliant materials.