Smart Home PCB Assembly
  • Detailed information

    Smart Home PCB Assembly

    For smart home applications, specifically temperature-sensitive cups, this PCB assembly from Guangzhou NOD Electronics Co. Ltd is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components. SMT and DIP processes are used. The unit undergoes automated optical inspection, and in-circuit and functional testing. Production complies with IPC-A-160 requirements.

    Smart Home PCB Assembly Capabilities

    7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
    4 DIP linesSMT/DIPAuto solder paste screen printer
    0201 componentIn circuit testReflow ovens with 10 zones
    0.25mm BGAFunction circuit testAuto optical inspection
    Laser stencilsBurn in testWave soldering (lead-free)
    Senju solder pasteBox BuildingX-ray

    Smart Home PCB Assembly Process Control

    NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

    pcb assembly process control

    Most of our customers are mainly from Europe, Middle East, America and Russia. Our aim is to achieve customer satisfaction through excellence in design, supply chain management, manufacturing and repair solutions. Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers. Using our X-Ray machine, we test PCBs to component level and all wiring is fully inspected and tested. Flash testing and earth bonding tests can also be undertaken where required.

Smart Home PCB Assembly

For smart home applications, specifically temperature-sensitive cups, this PCB assembly from Guangzhou NOD Electronics Co. Ltd is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components. SMT and DIP processes are used.

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