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Detailed information
Thermal Management for Power Components
Modern power components place high demands on the PCBA. NOD Electronics' PCB technology permits the selective embedding of thick copper pieces in standard FR4 PCBs, resulting in optimised thermal management for individual hotspots.
Capabilities of Thermal Management for Power Components
7 SMT lines Up to 12 layers Fuji & Samsung SMT mounters 4 DIP lines SMT/DIP Auto solder paste screen printer 0201 component In circuit test Reflow ovens with 10 zones 0.25mm BGA Function circuit test Auto optical inspection Laser stencils Burn in test Wave soldering (lead-free) Senju solder paste Box Building X-ray Process Control of Thermal Management for Power Components
NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
Our team will provide you with straightforward, expert and active support in the implementation of your power application, to ensure that your requirements are met, both technically and economically.
Thermal Management for Power Components PCB Assembly
Modern power components place high demands on the PCB. NOD Electronics' PCB technology permits the selective embedding of thick copper pieces in standard FR4 PCBs, resulting in optimised thermal management for individual hotspots.
