Advantages of Laser CUT SMT Stencils
Smooth internal pad walls(<= 3µm)
Aperture consistency reduces dpm’s
High Pad positional accuracy.
Stencil to PCB registration (caused by film distortion)
No chemicals – Environmentally friendly process.
Drastic reduction in print rejects
Clean and exact printing image of the solder paste
Fine-pitch screen <= 250µM can be realized without problems