How to manage components with high moisture sensitivity level
With the increasing use of high-precision components on the market，it is requested the factory should pay more attention on it before manufacturing, like shipment with moisture proof packaging, storage with desiccant, and etc. How to distinguish the components as high moisture sensitivity component ?
Attention to the label of outer package as below;
Humidity indicator card identification and description;
The first type of humidity indicator card has a “triangle arrow” (as shown in below). it indicates that the component has been wet and needs to be baked.
The second humidity indicator card consists of only three humidity levels shown as below
| Humidity environment : | ||||||
| HIC | 2%RH | 5%RH | 10%R | 55%RH | 60%RH | 65%RH |
5% | Blue | Light purple | Light pink | Pink | Pink | Pink |
10% | Blue | Blue | Light purple | Pink | Pink | Pink |
| 60% | Blue | Blue | Blue | Blue | Light purple | Pink |
| Use Condition | Level 2-5a can be used directly | Level 2-5a can be used directly | Level 2 can be used Level 2a-5a can be used after bake | Level 2 can be used Level 2a-5a can be used after bake | Level 2-5a can be used after bake | Level 2-5a can be used after bake |
Caution label on the moisture proof package;
After known about the MS component, below information can help you understand the MSL and how to manage it ; MSL can be divided into 8 levels and its management as below:
Level 1: small or equal 30℃/85% RH, unlimited floor life
Level 2: small or equal 30℃/60% RH, one year floor life
Level 2A: small or equal 30℃/60% RH, 4wks floor life
Level 3: small or equal 30℃/60 RH, 168hours floor life
Level 4: small or equal 30℃/60 RH, 72hours floor life
Level 5: small or equal 30℃/60 RH, 48hours floor life
Level 5A: small or equal 30℃/60RH, 24hours floor life
Level 6: small or equal 30℃/60RH,72hours floor life
(For level 6, MS components must be baked according to the labeled MS requirements before assembly;)
Attention:
1. Handle lightly, in order to avoid to damage the MSD components’ pins and BGA ball.
2. Static protection;
