Five major factors in achieving high reliability quality goals

Five major factors in achieving high reliability quality goals

Publish Date:2019-09-10 11:05:06 Clicks: 200

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At present, the domestic and international civil electronic product manufacturing industry generally adopts ANSJ-STD-001E, IPC-610E and IPC9 620B as the quality standards for electronic assembly.

The formation of solder joints on printed circuit board assemblies is directly affected by the layout of the pads. Therefore, the premise of implementing ANSI-STD11 00E and IPC-610E is that the layout and pad design of the PCBA must comply with IPC-7351, IPC-2221, and 12 IPC2222. Constraint.

If the quality standards of GJB and QJ are adopted, the quality standards such as QJ165B, QJ3011, QJ3012 and QJ3117A14 must comply with the requirements of GJB3243, GJB4057, GJB4907, QJ201B, QJ831B and QJ3103A15; if they do not comply with the requirements of these design standards, then The implementation of IPC-A-610E, ANSI/J-STD00E16 or GJB and QJ quality standards is not possible.

The implementation of IPC7351, IPC221 and IPC-222 is a prerequisite for the quality evaluation of ANSIJ-STD-001E and IPC-610E. To achieve the quality objectives of ANSI-STD001E, IPC-610E or GJB and QJ, the following four factors must be met.

1. Good design quality

Good design quality includes assembly method, package type of components used, component layout design, pad design and density design, solder joint reliability and process design, PCB structure, material and process design, etc.

“Design should be designed for manufacturing”, strengthen the manufacturability of the circuit, design the circuit design according to the requirements of standardization and standardization. The fundamental purpose of manufacturability design is that improving the design quality of the circuit design, and eliminating the problem as much as possible in the design phase. Design for Manufacturability (DFM) is another generic term for DFX technology and an important part of the key technologies of concurrent engineering throughout the enterprise development process. DFM is the design for the sake of making. Only by fully demonstrating and paying attention to the manufacturability, usability, detectability, manufacturing economy, and quality stability of the design at the initial stage of design, it is possible to achieve “zero defect design” and “zero defect”. The dual purpose of manufacturing is that only such a company can provide high-quality electronic products with high cost performance for customers and the market.

Design for manufacturability is a brand-new topic, a brand-new design concept; people have a process of knowing, understanding and mastering. Practice has proved that whoever masters, who benefits, earlier grasp and earlier benefit.

2. Qualified material quality

Qualified material quality includes process quality of components & PCBs, and storage and distribution management of components & PCBs. Our management team and some process technicians like to consider from the perspective of improving the process. In fact, many defects are caused by unqualified materials. Strengthening the quality control of materials will make half work with double results.

3. Process optimization and control

Congenital design lacks manufacturability defects and material quality problems, it is difficult to compensate by improving the process measures, which means that the process is by no means versatile! Good design quality and material quality will not naturally lead to reliable welding. Quality must be based on the optimization of welding process parameters, with the goal of establishing a complete process quality control system for process research and development.

4. Production site management

Production site management includes operational normative, anti-static management, environmental management, key process control point management, temperature and humidity management and 5S. The core is to improve execution! Many electronic research institutes and electronic factories are not without standards and norms, but their implementation is weak. The main reason is that the enterprise management should strengthen knowledge of technology.

5. Organizational assurance measures to achieve high reliability quality objectives

To achieve the above four objectives we must do the following: to establish a complete process system, including an independent process research department; to establish a relatively complete electrical equipment process specifications, including specifications for circuit design and manufacturing specifications, A corporate culture of manufacturability design; innovative ability to conduct advanced manufacturing technology research and establish a complete electrical technologist system as an organizational assurance measure.


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