Layout design flaws in reflow soldering applications
Publish Date:2019-11-18 16:14:09
Clicks: 247
The components are arranged in disorder.
The circuit function modules are not concentrated.
The components and through-hole spacing are not uniform.
The marks of the component’s polarity direction are chaotic.
The double-panel: large components, high-heat components correspond to the location of components.
The spacing of the chip peripheral components is too small.
The periphery of the chip (within one side of the side) is provided with a screw mounting hole.
The components are too large and easy to drop parts when the double-panel is reflowed at first-time
No specific soldering in the specific area.
There are no panels, fine pitch chip, single board reference point.
