Layout design flaws in reflow soldering applications

Layout design flaws in reflow soldering applications

Publish Date:2019-11-18 16:14:09 Clicks: 245


  • The components are arranged in disorder.

  • The circuit function modules are not concentrated.

  • The components and through-hole spacing are not uniform.

  • The marks of the component’s polarity direction are chaotic.

  • The double-panel: large components, high-heat components correspond to the location of components.

  • The spacing of the chip peripheral components is too small.

  • The periphery of the chip (within one side of the side) is provided with a screw mounting hole.

  • The components are too large and easy to drop parts when the double-panel is reflowed at first-time

  • No specific soldering in the specific area.

  • There are no panels, fine pitch chip, single board reference point.

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