In the previous example, the yield calculations involved two types opportunities—components and solder joints or terminations. This is similar to the problem presented in Figure 4,1, where the IC wast...

The defect rate for new PCBs is usually calculated based on process observations for existing PCBs. Assuming a PCB with through-hole technology, defects are usually obtained from three sources: incomi...

The electronic products being developed today are more complex than previous products. The number of components on each printed circuit board (PCB) is increasing，as well as the total number 〇f PCBs in...

Operations or Design SpecificationsA typical production line consists of multiple sources of materials and multiple distinct operations for fabrication and assembly of parts into the next-higher level...

A product contains 10 PCBs, and a goal of 95% turn on yield was 3et for each PCB at in-circuit test (ICT). The product final test turn-on yield will be as follows:A turn-on yield of 61% is disappointi...

In typical electronic manufacturing lines, printed circuit boards (PCBs) are assembled and tested individually. Multiple PCBs are then assembled into finished products, which are tested. The test engi...

In Figure 4.1, the wire bonding of an IC is shown. The chip is centered in the middle of the IC package frame, and wires are bonded from the chip to the frame. There are two bonds per IC termination....

The manufacturing yield determination is based on the definition of the probability of obtaining a defect. The FTY is the percentage number of units produced without defects, prior to test or inspecti...