The Main Process of PCBA Test
PCBA test is according to customized test method and process. Generally PCBA test process as below:
Program Loading-- ICT -- FCT -- Burn in test
1. Progarm Loading
After PCB board welding assembly, the engineers can do the program loading for each PCBA microcontroller, so that each microcontroller can achieve its specific function.
ICT test mainly through the test probe contact PCBA test points, to achieve PCBA circuit open circuit, short circuit and electronic components welding test. The accuracy of the ICT test is relatively high, clear instructions, wide usage.
FCT test can test the environment, current, voltage, pressure and other parameters of PCBA. The content of the test is more comprehensive, which can ensure that various parameters of PCBA board meet the requirements of customers. Before the test, more understanding what customer request, and pay more attention on it during the testing.
4, Burn-in Test
The burn-in test is performed by continuously conducting power to the PCBA board, simulating the scene used by the user, detecting some defects that are not easily found, inspecting the usage life of the products to ensure the stablity of the product.