What are the reasons for poor welding of QFN packaging in SMT processing?

What are the reasons for poor welding of QFN packaging in SMT processing?

Publish Date:2018-11-22 09:17:28 Clicks: 309

QFN packaging.jpg

Generally, the main reasons that affect the bad welding of QFN package are: PCB board design defects, pad pollution, QFN device welding end pollution, QFN device damp, steel mesh design defects, poor solder paste printing, reflow soldering temperature curve settings. When QFN welding is found to be poor, the problems can be analyzed from these aspects.



Copyright 2009-2025 All Rights Reserved by NOD Electronics
3F, Building A01, Ping'an Silicon Valley, Zengcheng District, Guangzhou 511399, China
Powered by MetInfo 7.2.0 ©2008-2025  mituo.cn