Backplane PCB Manufacturing
NOD Electronics is a major supplier of backplane assemblies and custom PCBA solutions. We expertise in high-speed interconnection offers a full range of backplane/midplane assembly solutions, from concept to manufacturing.
Our Capabilities of Backplane PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of Backplane PCB Manufacturing
The total costs of backplane PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours
We can build all types and sizes of backplanes, including some of the largest and most sophisticated back-panels in the world. We offer both leaded and lead-free processes, to assemble components onto a printed circuit backplane board. Components include active and passive devices, thru-hole (soldered) components, press fit (compliant) components, and a variety of mounting hardware. Full test and AOI capabilities insure the highest quality delivered products.