Copper Backing PCB Manufacturing
NOD Electronics offers thermal clad and metal printed circuit boards with a full selection of high performance or low cost materials from leading suppliers around the world. Thermal clad PCBA's are a dielectric metal base with a bonded copper circuit layer. This creates superior heat transfer to help cool components while eliminating problems associated with managing fragile ceramics.
With a wide range of electrical and thermally conductive interface pads, thermally conductive gap fillers, thermal phase change materials and thermally conductive electrically insulating materials, we can manufacture thermal clad & metal backing printed circuit boards that exceed all of our customers' expectations.
Our Capabilities of Copper Backing PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of Copper Backing PCB Manufacturing
The total costs of copper backing PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours
Our main markets are Europe, North America, South America and other countries. You'll get our prompt reply in 24H. 7 years for product and PCBA service, 100% on-time delivery. Welcome to send us Gerber file and BOM list for estimating at any time.