High Performance PCB Manufacturing
NOD Electronics use a mixture of automation and highly skilled manual assembly techniques. Naked die and packaged components can be assembled on the same substrate giving very high performance boards.
Our Capabilities of High Performance PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of High Performance PCB Manufacturing
The total costs of high performance PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours
NOD Electronics has the global technology, facilities and supply chains necessary to ensure rapid quoting and prototyping, as well as, a seamless and expedited transition to a high-volume manufacturing environment. NOD Electronics offers real-time collaboration, end-to-end project tracking and management, consistent quality control across facilities and the shortest time-to-market possible.