Semi-flex PCBS PCB Manufacturing
Since 2010 we have seen a growing request for flexible-, flex-rigid circuits. And over the latest years, an increase request for semi-flex circuits. Semi-flex PCBs use specialized FR-4 materials and a specific manufacturing method to create a flex-to-install design that can provide an economical solution for certain applications.
Our Capabilities of Semi-flex PCBS PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of Semi-flex PCBS PCB Manufacturing
The total costs of semi-flex PCBS PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours
The semi-flex stack-up offers significant cost advantages compared to traditional rigid-flex PCBs and is well suited for static bending stress during assembly and installation. Take advantage of our strength and experience and allow us to help you maintain your competitive edge. NOD Electronics can well positioned to support our customers through the entire product life cycle, from concept to volume production.