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Detailed information
Auto PCB Manufacturing
At Cleveland Circuits we recognize the importance of investing in the latest technology and automated equipment to provide our customers with high quality printed circuit boards and PCB assemblies with a flexible and responsive approach to our customers needs.
Our Capabilities of PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1 All of our PCB manufacturing equipment is selected to provide high quality processing with efficient throughput and minimal changeover times. By ensuring we select and invest in the right equipment we are able to provide high quality PCB assembly solutions for high mix, small to medium batch requirements.
