CEM-1 PCB Manufacturing
  • Detailed information

    CEM-1 PCB Manufacturing

    Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 is low-cost, flame-retardant, cellulose-paper-based laminate with only one layer of woven glass fabric.

    Our Capabilities of PCB Manufacturing

    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:1
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

    NOD Electronics has 10 years experience in CEM-1 PCB manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.

CEM-1 PCB Manufacturing

NOD Electronics has 10 years experience in CEM-1 circuit board manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.


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Building E, Qixing Industrial Area, Xintang Town, Zengcheng District, Guangzhou 511340, China
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