Communication PCB Fabrication and Assembly
  • Detailed information

    The communications network industry is evolving and changing, and it is critical for this fast-paced industry to meet its PCB needs without sacrificing quality requirements. NOD Electronics has the technical expertise to PCB design and manufacture durable printed circuit boards for a variety of applications, providing a range of systems from design to production.

    Our Capabilities of PCB Fabrication

    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:1
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

    Miniaturization, multi-functional communication products is the development trend, leading to the requirements of the circuit produce is getting higher and higher, NOD Electronics has many years of electronic processing experience, we can meet  the licensing requirements and process requirements of your communications products, such as high-frequency PCB , High temperature PCB and high density PCB.


Communication PCB Fabrication and Assembly

NOD Electronics has the technical expertise to design and manufacture durable printed circuit boards for a variety of applications, providing a range of systems from design to production.


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