The communications network industry is evolving and changing, and it is critical for this fast-paced industry to meet its PCB needs without sacrificing quality requirements. NOD Electronics has the technical expertise to PCB design and manufacture durable printed circuit boards for a variety of applications, providing a range of systems from design to production.
Our Capabilities of PCB Fabrication
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Miniaturization, multi-functional communication products is the development trend, leading to the requirements of the circuit produce is getting higher and higher, NOD Electronics has many years of electronic processing experience, we can meet the licensing requirements and process requirements of your communications products, such as high-frequency PCB , High temperature PCB and high density PCB.