ENIG PCB Manufacturing
The best features of ENIGs its flat surface and excellent solderability. The Electroless Nickel is an auto-catalytic process that deposits Nickel on a Palladium catalyzed Copper surface. Immersion Gold is replacement chemistry. In other words, it attaches to the Nickel by replacing atoms of Nickel with atoms of Gold. The recommended Gold thickness is 2-4 µin. The purpose of the immersion Gold layer is to protect the Nickel surface and maintain its solderability.
Our Capabilities of PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our PCB manufacturing capabilities can meet almost 95% demand of custom requirements and actually we concentrated on this field for decades.