ENIG PCB Manufacturing
  • Detailed information

    ENIG PCB Manufacturing

    The best features of ENIGs its flat surface and excellent solderability. The Electroless Nickel is an auto-catalytic process that deposits Nickel on a Palladium catalyzed Copper surface. Immersion Gold is replacement chemistry. In other words, it attaches to the Nickel by replacing atoms of Nickel with atoms of Gold. The recommended Gold thickness is 2-4 µin. The purpose of the immersion Gold layer is to protect the Nickel surface and maintain its solderability.

    Our Capabilities of PCB Manufacturing

    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:1
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

    NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our PCB manufacturing capabilities can meet almost 95% demand of custom requirements and actually we concentrated on this field for decades.


ENIG PCB Manufacturing

The best features of ENIGs its flat surface and excellent solderability. The Electroless Nickel is an auto-catalytic process that deposits Nickel on a Palladium catalyzed Copper surface. Immersion Gold is replacement chemistry.


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