OSP PCB Manufacturing
  • Detailed information

    OSP PCB Manufacturing

    Organic Solder Preservative, commonly referred to as OSP Finish, is the leader in low cost surface finishes. It is designed to produce a thin, uniform, protective layer on the copper surface of the PCB that shields the circuitry from oxidization during storage and assembly operations. While OSP Finish has been around for quite some time, it has only recently gained popularity as customers increase their search for Lead-free and fine pitch options.

    Our Capabilities of PCB Manufacturing

    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:1
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

    As a service-leading PCB manufacturing and PCB assembly (PCBA) partner, NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our turnkey or consigned PCB assembly service meets IPC Class 3 standards and is ISO 9001:2008-certified, RoHS compliant .

OSP PCB Manufacturing

As a service-leading PCB manufacturing and PCB assembly (PCBA) partner, NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our turnkey or consigned PCB assembly service meets IPC Class 3 standards and is ISO 9001:2008-certified, RoHS compliant .


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