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Detailed information
OSP PCB Manufacturing
Organic Solder Preservative, commonly referred to as OSP Finish, is the leader in low cost surface finishes. It is designed to produce a thin, uniform, protective layer on the copper surface of the PCB that shields the circuitry from oxidization during storage and assembly operations. While OSP Finish has been around for quite some time, it has only recently gained popularity as customers increase their search for Lead-free and fine pitch options.
Our Capabilities of PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1 As a service-leading PCB manufacturing and PCB assembly (PCBA) partner, NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our turnkey or consigned PCB assembly service meets IPC Class 3 standards and is ISO 9001:2008-certified, RoHS compliant .
OSP PCB Manufacturing
As a service-leading PCB manufacturing and PCB assembly (PCBA) partner, NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our turnkey or consigned PCB assembly service meets IPC Class 3 standards and is ISO 9001:2008-certified, RoHS compliant .
