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Detailed information
High Performance PCB Assembly
NOD Electronics use a mixture of automation and highly skilled manual assembly techniques. Naked die and packaged components can be assembled on the same substrate giving very high performance boards.
High Performance PCB Assembly Capabilities
7 SMT lines Up to 12 layers Fuji & Samsung SMT mounters 4 DIP lines SMT/DIP Auto solder paste screen printer 0201 component In circuit test Reflow ovens with 10 zones 0.25mm BGA Function circuit test Auto optical inspection Laser stencils Burn in test Wave soldering (lead-free) Senju solder paste Box Building X-ray High Performance PCB Assembly Process Control
NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
NOD Electronics has the global technology, facilities and supply chains necessary to ensure rapid quoting and prototyping, as well as, a seamless and expedited transition to a high-volume PCB manufacturing environment. NOD Electronics offers real-time collaboration, end-to-end project tracking and management, consistent quality control across facilities and the shortest time-to-market possible.
