Organic Solderability Preservative PCB Assembly
OSP (Organic Solderability Preservative) or anti-tarnish preserves the copper surface from oxidation by applying a very thin protective layer of material over the exposed copper usually using a conveyorized process.
Organic Solderability Preservative PCB Assembly Capabilities
7 SMT lines Up to 12 layers Fuji & Samsung SMT mounters 4 DIP lines SMT/DIP Auto solder paste screen printer 0201 component In circuit test Reflow ovens with 10 zones 0.25mm BGA Function circuit test Auto optical inspection Laser stencils Burn in test Wave soldering (lead-free) Senju solder paste Box Building X-ray
Organic Solderability Preservative PCB Assembly Process Control
NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
Take advantage of our strength and experience and allow us to help you maintain your competitive edge. NOD Electronics can well positioned to support our customers through the entire product life cycle, from concept to volume production.