As can be seen by the example above, Design of experiments can optimize a process or a product easily and quickly by using very simple mathematical techniques. It is also not necessary to have an in-d...

In this example, the specification for the peel strength for a mechanical bonding assembly was increased using an L9 DoE. An RTV adhesive was selected as the bonding agent (glue)....

The DoE analysis tool set consists of using graphical as well as statistical analysis to determine which individual factors are significant， and how to set the quality characteristic to its design goa...

One of the pioneers in using DoE for new product PCB design and manufacturing is Dr. Genishi Taguchi. Sometimes his name was synonymous with DoE, as in the “Taguchi methods.”...

The techniques for DoE designs using the orthogonal arrays for more than two or three levels are explored in this section. Multilevel arrangements can be made when columns representing factors are com...

The manufacturing plan for printed circuit boards can change frequently. Some of the changes could be the batch run sizes, the work holder sizes, or the quality of the assembly process steps. This can...

In this system, component technology and process methodology selection is used in calculating the costs of the PCBs. A single cost driver is assigned to each PCB production or assembly step, including...

Since material costs account for the majority of PCB costs, all other costs are calculated as a percentage of the material used in the PCB BOM. Cost parameters are shown in Table 6.5 for typical commu...