• SMT Solvent Cleaning Equipment / Machine To Clean Flux with Water

    12-10-2016

    SMT Solvent Cleaning Equipment / Machine To Clean Flux with Water

    After soldering, the electronic assemblies must be cleaned to remove excess solder flux. The subjects of flux and cleaning are closely intertwined. The selection of solvent and cleaning equipment...
    More
  • Soldering Station Guide

    12-10-2016

    Soldering Station Guide

    About Soldering StationA soldering station is a soldering tool with a separate station to control temperature and a soldering iron. A soldering station can be either anal...
    More
  • SMT Solder Paste Screen Printer Machine for Solder Paste Screen Printing

    12-10-2016

    SMT Solder Paste Screen Printer Machine for Solder Paste Screen Printing

    A Solder Paste Screen Printer for SMT is needed to screen solder paste onto the printed circuit board (PCB) before placement of surface mount components.Solder Paste Screen Printer for SMT have been w...
    More
  • SMT in Assembly Line for Manufacturing and Production of Surface Mount Technology PCB Assembly

    12-10-2016

    SMT in Assembly Line for Manufacturing and Production of Surface Mount Technology PCB Assembly

    For successful implementation of Surface Mount Technology (SMT) in the assembly line for manufacturing and production, the first order of business for management consideration is to obtain a...
    More
  • Benefits / Advantages of Surface Mount Technology (SMT) Over Through-Hole

    12-10-2016

    Benefits / Advantages of Surface Mount Technology (SMT) Over Through-Hole

    Surface mount components are small and can be mounted on either side of the PCB and have gained widespread usage in electronics. The benefits of SMT or Surface Mount Technology are available in b...
    More
  • BGA (Ball Grid Array): Repairing and Soldering BGA

    12-10-2016

    BGA (Ball Grid Array): Repairing and Soldering BGA

    BGA SolderingDuring the initial stages, BGA technology was a matter of concern. People had doubts on solderability and reliability of BGA components. In BGA, the pads are under the device and not...
    More
  • Surface Mount Design Considerations in SMT & CTE Mismatching

    12-10-2016

    Surface Mount Design Considerations in SMT & CTE Mismatching

    There are many design issues that must be settled before a surface mount technology design or packaging direction is selected.System analysts start with determining product needs in the marketplace. T...
    More
  • Ball Grid Array (BGA) Package

    12-10-2016

    Ball Grid Array (BGA) Package

    Ball Grid Array or BGA is a surface-mount package (with no leads) utilizing an array of metal spheres (solder balls) for electrical interconnection. BGA solder balls are attached to a l...
    More

Copyright 2009-2025 All Rights Reserved by NOD Electronics
3F, Building A01, Ping'an Silicon Valley, Zengcheng District, Guangzhou 511399, China
Powered by MetInfo 7.2.0 ©2008-2025  mituo.cn