Operations or Design SpecificationsA typical production line consists of multiple sources of materials and multiple distinct operations for fabrication and assembly of parts into the next-higher level...

A product contains 10 PCBs, and a goal of 95% turn on yield was 3et for each PCB at in-circuit test (ICT). The product final test turn-on yield will be as follows:A turn-on yield of 61% is disappointi...

In typical electronic manufacturing lines, printed circuit boards (PCBs) are assembled and tested individually. Multiple PCBs are then assembled into finished products, which are tested. The test engi...

In Figure 4.1, the wire bonding of an IC is shown. The chip is centered in the middle of the IC package frame, and wires are bonded from the chip to the frame. There are two bonds per IC termination....

The manufacturing yield determination is based on the definition of the probability of obtaining a defect. The FTY is the percentage number of units produced without defects, prior to test or inspecti...

The basic definition of a defect is one that is based on the Poisson distribution. The defect rate, or defects per unit (DPU), is calculated based on defects, opportunities, and units. Defects are any...

Manufacturing is a multistep process, with each step generating its own variability, and therefore contributing to the overall defect rate. In a large multistep operation, individual process quality h...

Scatter diagrams are simple graphical methods used to study relationships between two variables. They can quickly determine if a relationship exists (positive or negative) and the strength of that rel...