The product realization process has undergone several changes with the advent of concurrent engineering. The change from a serial process of product development to a more parallel process has resulted...

Concurrent engineering principles came to the fore as a strategic set of four goals for new product development: high quality, low cost, reduced engineering change orders (ECOs) and time to market, an...

The revolution in the high-technology industries has shrunk design and use product life cycles to a period of weeks and months through concurrent engineering. At the same time, traditional design and ...

For electronic products, most of the defects will be generated in the PCBs, as discussed in Chapter 4. The final product might consist of many other mechanical and electrical parts, including sheet me...

Six sigma quality analyses of new product elements will produce the total expected defects from design and manufacturing. These defects will have to be removed by test systems at various locations in ...

Screening DoE followed by in-depth DoE for defect elimination in thermal printer design. The design of new thermal printer for foil printing involved a team of many disciplines： mechanical, electrical...

Six sigma design quality analyses for new products include the modeling and simulation of major circuit components and assemblies during the early phase of the design....

A good example of new process optimization is the introduction of fine pitch SMT into the manufacturing process. Fine pitch SMT requires smaller solder paste deposition of solder bricks with a target ...