• In Addition to Excavate Talent in TAIWAN, How should China's Semiconductor Industry Develop?

    07-01-2017

    In Addition to Excavate Talent in TAIWAN, How should China's Semiconductor Industry Develop?

    Recently, SMIC issued a statement that Shanyi JIANG, the former co-operation of TSMC, will serve as an independent director of SMIC. In SMIC announced SHANGYI JIANG as its independent director, a Taiw...
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  • What are the Requirements of PCB Tray in SMT Production?

    06-01-2017

    What are the Requirements of PCB Tray in SMT Production?

    In the processing process of PCB board, in order to protect the PCB board from electrostatic hazards, will use the PCB tray or PCB card board to place. PCB tray full name of anti-static tray, the main...
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  • The US Block China's Semiconductor Industry Development -- Opportunities or Blow

    05-01-2017

    The US Block China's Semiconductor Industry Development -- Opportunities or Blow

    The US President Barack Obama recently released a new study, made recommendations to strengthen the protection of the US semiconductor industry, limiting foreign investment, acquisition and merger of...
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  • How to Buy BGA Rework Station?

    04-01-2017

    How to Buy BGA Rework Station?

    With the BGA chip in the electronic processing of a wide range of applications, including computer motherboards, mobile phones, web cameras, TV motherboards, communications products and other fields,...
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  • The Significance and Advantages of AOI inspection Equipment in SMT Production

    04-01-2017

    The Significance and Advantages of AOI inspection Equipment in SMT Production

    In the SMT production, the equipment of the different parts to play a different role, the automatic optical inspection device is scanned optically by the CCD camera to read the image of the device and...
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  • Development Trend of Solder Paste Printing Equipment Technology

    31-12-2016

    Development Trend of Solder Paste Printing Equipment Technology

    Nowadays electronic processing technology is becoming more and more mature. In order to adapt to the trend of fine pitch and high density electronic packaging technology such as QFP, SOP, BGA, CSP, 01...
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  • What are the Challenges of Wave Soldering in Electronic Processing?

    31-12-2016

    What are the Challenges of Wave Soldering in Electronic Processing?

    In the electronic processing plants, SMT processing and DIP processing technology has become mature and widely used, and are relatively high efficiency of the welding process. However, with the increa...
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  • Comparison of lead and lead-free processes in Electronic Processing Plants

    29-12-2016

    Comparison of lead and lead-free processes in Electronic Processing Plants

    Now, there are two kinds of processing technology in the PCB assembly plant. According to the customer's demand, there are lead-free processing technology and lead processing technology. In fact a...
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