A Solder Paste Screen Printer for SMT is needed to screen solder paste onto the printed circuit board (PCB) before placement of surface mount components.Solder Paste Screen Printer for SMT have been w...

For successful implementation of Surface Mount Technology (SMT) in the assembly line for manufacturing and production, the first order of business for management consideration is to obtain a...

Surface mount components are small and can be mounted on either side of the PCB and have gained widespread usage in electronics. The benefits of SMT or Surface Mount Technology are available in b...

BGA SolderingDuring the initial stages, BGA technology was a matter of concern. People had doubts on solderability and reliability of BGA components. In BGA, the pads are under the device and not...

There are many design issues that must be settled before a surface mount technology design or packaging direction is selected.System analysts start with determining product needs in the marketplace. T...

Ball Grid Array or BGA is a surface-mount package (with no leads) utilizing an array of metal spheres (solder balls) for electrical interconnection. BGA solder balls are attached to a l...

SMD or Surface Mount Electronic Components for SMT are no different from through-hole components as far as the electrical function is concerned. Because they are smaller, however, the S...

SMT (Surface Mount Technology) is a packaging technology in electronics that mounts electronic components on the surface of a printed circuit board / Printed Wiring Board (PCB / PWB) instead of insert...