BGA SolderingDuring the initial stages, BGA technology was a matter of concern. People had doubts on solderability and reliability of BGA components. In BGA, the pads are under the device and not...

There are many design issues that must be settled before a surface mount technology design or packaging direction is selected.System analysts start with determining product needs in the marketplace. T...

Ball Grid Array or BGA is a surface-mount package (with no leads) utilizing an array of metal spheres (solder balls) for electrical interconnection. BGA solder balls are attached to a l...

SMD or Surface Mount Electronic Components for SMT are no different from through-hole components as far as the electrical function is concerned. Because they are smaller, however, the S...

SMT (Surface Mount Technology) is a packaging technology in electronics that mounts electronic components on the surface of a printed circuit board / Printed Wiring Board (PCB / PWB) instead of insert...

Rework and hand soldering of BGA Packages is the toughest part. It needs practice to do the job. Let us understand Desoldering and soldering of BGA packages:Desoldering BGAThe most common pr...

BGA or Ball Grid Array is one type of packaging for Surface Mount Technology (where SMD electronic components are actually ‘mounted’ or affixed on the surface of the SMT printed circuit boar...

SMT (Surface Mount Technology) needs several types of equipment. Pick-and-Place machine is the heart of surface mount. A pick-and-place machine picks and places electronic components onto th...